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| product structure silicon monolithic integrated circuit this product is not designed with pr otection against radioactive rays. 1/23 datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 21.dec.2012 rev.002 1a variable / fixed output ldo regulators bdxxic0wefj / bdxxic0whfv general description bdxxic0w series devices are ldo regulators with an output current of 1.0a. the output a ccuracy is 1% of the output voltage. both fixed and variable output voltage devices are av ailable. the output voltage of the variable output voltage device can be varied from 0.8 to 4.5v using external resistors. various fixed output voltage dev ices that do not use external resistors are also available. these ldo regulators are av ailable in two package types: htsop-j8 (4.90mm x 6.00mm x 1.00mm) and hvsof6 (1.60mm x 3.00mm x 0.75mm), and can be used in a wide variety of digital appliances. these devices have built in over current protection to protect the device when output is shorted, 0a shutdo wn mode and thermal shutdown circuit to protect the device during over load conditi ons. these ldo regulators are usable with ceramic capacitors that enable a smaller layout and longer life. features ? +/-1% output voltage accuracy ? built-in over current protection circuit (ocp) ? built-in thermal shut down circuit (tsd) ? zero a shutdown mode key specifications input power supply voltage r ange: 2.4v to 5.5v output voltage range(variable type): 0.8v to 4.5v output voltage(fixed type ): 1.0v/1.2v/1.25v/1.5v 1.8v/2.5v/2.6v/3.0v/3.3v (1.25v/2.6v:hvsof6 only) output current: 1.0a (max.) shutdown current: 0 a (typ.) operating temperature range: -25 to +85 typical application circuit package (typ.) (typ.) (max.) htsop-j8 4.90mm x 6.00mm x 1.00mm hvsof6 1.60mm x 3.00mm x 0.75mm htsop-j8 hvsof6 r 1 v o v cc en gnd fin r 2 fb c out c in c in ,c out : ceramic capacitor output voltage variable type v o v cc en gnd fin v o _ s c out c in c in ,c out : ceramic capacitor output voltage fixed type
2/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 ordering information b d x x i c 0 w y y y - z z part number output voltage 00:variable 10:1.0v 12:1.2v 1c:1.25v 15:1.5v 18:1.8v 25:2.5v 26:2.6v 30:3.0v 33:3.3v input voltage range :7v output current c0:1.0a shutdown mode ?w? included package efj : htsop-j8 hfv : hvsof6 packaging and forming specification e2 : emboss tape reel(htsop-j8) gtr : emboss tape reel(hvsof6) 3/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 block diagram bd00ic0wefj / bd00ic0whfv (variable output voltage type) pin configuration and pin description (htsop-j8) pin no. pin name pin function 1 v o output pin 2 fb feedback pin 3 gnd gnd pin 4 n.c no connect (connect to gnd or leave open) 5 en enable pin 6 n.c no connect (connect to gnd or leave open) 7 n.c no connect (connect to gnd or leave open) 8 v cc input pin reverse fin substrate (connect to gnd) (hvsof6) pin no. pin name pin function 1 v o output pin 2 fb feedback pin 3 gnd gnd pin 4 en enable pin 5 n.c no connect (connect to gnd or leave open) 6 v cc input pin reverse fin substrate (connect to gnd) fig.1 block diagram gnd en tsd ocp soft start v o v cc fb 8 7 6 5 1 2 3 4 v o fb gnd n.c en n.c n.c v cc 6 5 4 1 2 3 vo fb en n.c vcc gnd 4/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 block diagram bdxxic0wefj / bdxxic0whfv (fixed output voltage type) pin configuration and pin description (htsop-j8) pin no. pin name pin function 1 v o output pin 2 v o_s output voltage monitor pin 3 gnd gnd pin 4 n.c no connect (connect to gnd or leave open) 5 en enable pin 6 n.c no connect (connect to gnd or leave open) 7 n.c no connect (connect to gnd or leave open) 8 v cc input pin reverse fin substrate (connect to gnd) (hvsof6) pin no. pin name pin function 1 v o output pin 2 v o_s output voltage monitor pin 3 gnd gnd pin 4 en enable pin 5 n.c no connect (connect to gnd or leave open) 6 v cc input pin reverse fin substrate (connect to gnd) 8 7 6 5 1 2 3 4 v o v o_s gnd n.c en n.c n.c v cc 6 5 4 1 2 3 v o v o_s gnd en n.c v cc gnd en tsd ocp soft start v o v cc v o_s fig.2 block diagram 5/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 absolute maximum ratings (ta=25 ) parameter symbol ratings unit power supply voltage v cc 7.0 * 1 v en voltage v en 7.0 v power dissipation htsop-j8 pd 2110 *2 mw operating temperature ra nge topr -25 to +85 storage temperature range tstg -55 to +150 junction temperature tjmax +150 *1 not to exceed pd *2 reduced by 16.9mw/ for each increase in ta of 1 over 25 . (when mounted on a board 70mm 70mm 1.6mm glass-epoxy board, two layer) recommended operating ratings (ta=25 ) ratings parameter symbol min. max. unit input power supply voltage v cc 2.4 5.5 v en voltage v en 0.0 5.5 v output voltage setting range v o 0.8 4.5 v output current i o 0.0 1.0 a electrical characteristics (unless otherwise noted, ta=25 , en=3v, v cc =3.3v, r1=16k , r2=7.5k ) limits parameter symbol min. typ. max. unit conditions circuit current at shutdown mode i stb - 0 5 a v en =0v, off mode bias current i cc - 250 500 a line regulation reg.ii -1 - 1 % v cc =( v o +0.6v ) 5.5v load regulation reg i o -1.5 - 1.5 % i o =0 1.0a minimum dropout voltage1 v co1 - 0.10 0.15 v v cc =3.3v, i o =250ma minimum dropout voltage2 v co2 - 0.20 0.30 v v cc =3.3v, i o =500ma minimum dropout voltage3 v co3 - 0.30 0.45 v v cc =3.3v, i o =750ma minimum dropout voltage4 v co4 - 0.40 0.60 v v cc =3.3v, i o =1.0a output reference voltage(variable type) v fb 0.792 0.800 0.808 v i o =0a output voltage(fixed type) v o vo 0.99 vo vo 1.01 v i o =0a en low voltage v en_low 0 - 0.8 v en high voltage v en_high 2.4 - 5.5 v en bias current i en 1 3 9 a 6/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 typical performance curves (unless otherwise noted, ta=25 , en=3v, v cc =3.3v, r1=16k , r2=7.5k ) fig.3 transient response(0 1.0a) co=1.0f v o i o fig.4 transient response(1.0 0a) co=1.0f v o i o v o i o fig.5 input sequence1 co=1.0f v cc v o fig.6 off sequence 1 co=1.0f v cc v o v o v o i o i o v en v en 7/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.10 ta - v o (i o =0a) fig.7 input sequence2 co=1.0f v cc v o fig.8 off sequence 2 co=1.0f v cc v o v en v en v o [v] ta [ ] ta [ ] fig.9 ta - v fb v fb [v] 8/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.11 ta - i cc ta [ ] i cc [a] fig.12 ta - i stb (v en =0v) ta [ ] i stb [a] fig.13 v cc -i stb (v en =0v) v cc [v] i stb [a] fig.14 ta - i en ta [ ] i en [a] 9/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.15 i o -v o (v o =1.2v) i o [a] v o [v] fig.16 i o -v o (v o =1.5v) i o [a] v o [v] fig.17 i o -v o (v o =1.8v) i o [a] v o [v] fig.18 i o -v o (v o =2.5v) i o [a] v o [v] 10/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.19 i o -v o (v o =3.3v) i o [a] v o [v] fig.20 v cc -v o (i o =0a) v cc [v] v o [v] fig.21 tsd (i o =0a) ta [ ] v o [v] fig.22 ocp (v cc =5v, v o =3.3v) i o [a] v o [v] 11/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.23 ocp (v cc =5v, v o =2.5v) i o [a] v o [v] fig.24 ocp (v cc =5v, v o =1.8v) i o [a] v o [v] fig.25 ocp (v cc =5v, v o =1.5 v) i o [a] v o [v] fig.26 ocp (v cc =5v, v o =1.2 v) i o [a] v o [v] 12/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.27 ocp (v cc =3.3v, v o =2.5v) i o [a] v o [v] fig.28 ocp (v cc =3.3v, v o =1.8v) i o [a] v o [v] fig.29 ocp (v cc =3.3v, v o =1.5 v) i o [a] v o [v] fig.30 ocp (v cc =3.3v, v o =1.2 v) i o [a] v o [v] 13/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.34 minimum dropout voltage 1 (v cc =3.3v, i o =1.0a) fig.32 i o -i cc fig.33 psrr(i o =0a) fig.31 esr-io characteristics (co=2.2f) i o [a] i o [a] vdrop[v] ta [ ] 14/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 fig.36 minimum dropout voltage3 (v cc =3.3v) fig.37 minimum dropout voltage4 ( v cc =5.0v ) fig.35 minimum dropout voltage2 (v cc =2.4v) i o [a] i o [a] i o [a] 15/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 power dissipation htsop-j8 hvsof6 measurement condition: mounted on a rohm board, substrate size: 70mm 70mm 1.6mm (substrate with thermal via) ? solder the thermal pad to ground ic only j-a=249.5 /w 1-layer copper foil are :0mm 0mm j-a=153.2 /w 2-layer copper foil are :15mm 15mm j-a=113.6 /w 2-layer copper foil are :70mm 70mm j-a=59.2 /w 4-layer copper foil are :70mm 70mm j-a=33.3 /w power dissipation :pd [w] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 0.50w ?? :ta [ ] 1.0 0.50w 0.82w 1.10w 2.11w 3.76w ambient temperature :ta [ ] measurement condition: mounted on a rohm board, substrate size: 70mm 70mm 1.6mm (substrate with thermal via) ? solder the thermal pad to ground single-layer(copper foil are :2%) j-a=147.1 /w single-layer(copper foil are :18%) j-a=89.3 /w single-layer(copper foil are :51%) j-a=73.5 /w 0.0 1.0 2.0 3.0 4.0 0 25 50 75 100 125 150 ambient t empera ture: t a [] power dissipation: pd [w] 1.7w 1.4w 0.85w 16/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 thermal design should ensure operation within the following co nditions. note that the temper atures listed are the allowed temperature limits and thermal design should a llow sufficient margin beyond these limits. 1. ambient temperature ta can be no higher than 85 . 2. chip junction temperature (tj) can be no higher than 150 . chip junction temperature can be determined as follows: calculation based on ambient temperature (ta) tj=ta+ j-a p reference values j-a htsop-j8 153.2/w 113.6 /w 59.2 /w 33.3 /w 1-layer substrate (copper foil density 0mm 0mm) 2-layer substrate (copper foil density 15mm 15mm) 2-layer substrate (copper foil density 70mm 70mm) 4-layer substrate (copper foil density 70mm 70mm) substrate size: 70mm 70mm 1.6mm (substrate with thermal via) most of the heat loss that occu rs in the bdxxic0w series is generated from the output pch fet. power loss is determined by the total v cc -v o voltage and output current. be sure to confirm the system input and output voltage as well as the output current conditions in relation to the heat dissipation characteristics of the v cc and v o in the design. bearing in mind that heat dissipation may vary substantially depending on t he substrate employed (due to the powe r package incorporated in the bdxxic0w series )make certain to factor conditions such as substrate size into the thermal design. power consumption [w] = input voltage (v cc ) - output voltage (v o ) i o (ave) example) when v cc =3.3v, v o =2.5v, i o (ave) = 0.1a power consumption [w] = 3.3v - 2.5v 0.1a =0.08[w] 17/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 input-to-output capacitor it is recommended that a capacitor (over 1uf) is placed near pins between the input pin and gnd as well as the output pin and gnd. a capacitor, between input pin and gnd, is valid wh en the power supply impedance is high or trace is long. also, as for the capacitor between the output pi n and gnd, the greater the capacitance, the more sustainable the line regulation will be and the capacitor will make improvements of characteristics depending on the load. however, please check the actual functionality of this part by mounting it on a board for the actual application. ceramic capacitors usually have differe nt, thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use. for additional details, please check with the manufacturer, and select the best ceramic capacitor for your application. equivalent series resistance esr (output capacitor) to prevent oscillations, please attach a capacitor between v o and gnd. capacitors usually have esr (equivalent series resistance). operation will be stable in the esr-i o range shown to the right. ceramic, tantalum and electrolytic capacitors have different esr values, so please ensure that you are usi ng a capacitor that operates in the stable operating region shown on the right. finally, please evaluate in the actual application. dc bias voltage [v] ceramic capacitor capacity ? dc bias characteristics (characteristics example) 0.01 0.10 1.00 10.00 0 0.2 0.4 0.6 0.8 1 io [a] esr [ ] safety area esr ? i o characteristics -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 0 1 2 3 4 rated voltage 10v b1 characteristics rated voltage 4v x6s characteristics capacitance change [%] rated voltage:10v f characteristics rated voltage 6.3v b characteristics b characteristics rated voltage 10v c o =1uf 18/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 evaluation board circuit evaluation board parts list designation value part no. company designation value part no. company r1 16k mcr01pzpzf1602 rohm c4 \ \ \ r2 7.5k mcr01pzpzf7501 rohm c5 1f cm105b105k10a kyocera r3 \ \ \ c6 \ \ \ r4 \ \ \ c7 \ \ \ r5 \ \ \ c8 \ \ \ r6 \ \ \ c9 \ \ \ c1 1f cm105b105k16a kyocera c10 \ \ \ c2 \ \ u1 \ bd00ic0wefj rohm c3 \ \ u2 \ \ \ board layout pcb layout considerations: ? input capacitor c in connected to v cc (vin) should be placed as close to v cc (v in ) pin as possible. output capacitor c out also should be placed as close to ic pin as possible. in case the part is connected to inner layer gnd plane, please use several through holes. ? fb pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as possible. please take care of this during layout. ? please make gnd pattern wide enough to handle thermal dissipation. ? for output voltage setting output voltage can be set by fb pin voltage (0.800v typ.) and external resistance r1, r2. (the use of resistors with r1+r2=1k to 90k is recommended) n.c gnd fb n.c n.c. v o 2 v o c7 3 4 7 5 u1 8 c1 c2 c3 r1 r2 c6 c5 1 v cc 6 en gnd sw1 en fin v o en gnd ( v cc v in ) c in r 1 r2 c out v o = v fb r1+r2 r2 19/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 i/o equivalent circuits (variable type bd00ic0wefj ) 8pin(v cc ) / 1pin(v o ) 2pin(fb) 5pin(en) i/o equivalent circuits (fixed type bdxxic0wefj ) i/o equivalent circuits (variable type bd00ic0whfv ) 6pin(v cc ) / 1pin(v o ) 2pin(fb) 4pin(en) i/o equivalent circuits (fixed type bdxxic0whfv ) 2pin(fb) 8pin(v cc ) 1pn(v o ) 5pin(en) 520k 480k 8pin(v cc ) / 1pin(v o ) 2pin(v o_s ) 5pin(en) 8pin(v cc ) 1pin(v o ) 2pin(v o_s ) 5pin(en) 520k 480k 6pin(v cc ) / 1pin(v o ) 2pin(v o_s ) 4pin(en) 6pin(v cc ) 1pin(v o ) 2pin(v o_s ) 4pin(en) 520k 480k 2pin(fb) 6pin(v cc ) 1pn(v o ) 4pin(en) 520k 480k 20/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit. if there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage the ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design the pcb layout pattern to provide low impedance g nd and supply lines. to obtain a low noise ground and supply line, separate the ground section and s upply lines of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and gnd terminal. when using electrolytic capacitors in a circuit, note that capacitance values are re duced at low temperatures and over time. (4) gnd voltage the potential of the gnd pin must be minimu m potential under all operating conditions. (5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. (6) off-leakage at high temperature. off-leakage at high temperature may incr ease because of manufacturing variations. design should consider the typi cal & worst cases shown below. (7) inter-pin shorts and mounting errors use caution when positioning the ic for mounting on printed circuit boards. the ic may be damaged if there is any connection error or if pi ns are shorted together. (8) actions in strong electromagnetic field use caution when using the ic in the pr esence of a strong electromagnetic field as doing so may cause the ic to malfunction. (9) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (10) thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guar antee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. tsd on temperature[ ] (typ.) hysteresis temperature [ ] (typ.) bdxxic0w series 175 15 ta-ileak 0 0.1 0.2 0.3 0.4 0.5 25 50 75 100 125 150 temperature () ileak (ma) typ worst 21/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 (11)testing on application boards when testing the ic on an application board, connecting a capacito r to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic?s power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. (12) regarding input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent el ements in order to keep them isolated. p-n junctions are formed at the intersecti on of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. t he operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. (13) ground wiring pattern. when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of application so that t he pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element 22/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 physical dimension tape and reel information marking diagram xx product name 00 bd00ic0wefj 10 bd10ic0wefj 12 bd12ic0wefj 15 bd15ic0wefj 18 bd18ic0wefj 25 bd25ic0wefj 30 bd30ic0wefj 33 bd33ic0wefj xx product name b0 bd00ic0whfv bt bd10ic0whfv bu bd12ic0whfv bs bd1cic0whfv bv bd15ic0whfv bw bd18ic0whfv bx bd25ic0whfv br bd26ic0whfv by bd30ic0whfv bz bd33ic0whfv (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. 23/23 bdxxic0wefj / bdxxic0whfv datasheet tsz02201-0r6r0a600430-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.dec.2012 rev.002 revision history date revision changes 6.jul.2012 001 new release. 21.dec.2012 002 the description was modified. datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. |
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